In mid-September, the China Semiconductor Industry Association released data on China's IC industry in the first half of 2011. IC packaging and testing industry boosted sales revenue by 10.9% year-on-year thanks to the launch of new projects such as Haitai Semiconductor in Wuxi New District. With a scale of 36.414 billion yuan, it is still the leader in China's integrated circuit industry.
The report shows that in the first half of the year China's total integrated circuit production reached 40.56 billion, a year-on-year increase of 25.2%. The industry achieved sales revenue of 79.326 billion yuan, a year-on-year growth rate of 19.1%. Among them, IC design industry sales were 18.602 billion yuan and chip manufacturing 24.31 billion yuan. The packaging and testing industry accounted for 46% of China's IC industry, far higher than the global share of 18%.
China's packaging and testing industry layout Yu Zhongyu, honorary chairman of the China Semiconductor Industry Association, once stated that in the entire semiconductor industry chain, China's most promising potential is the industry of packaging and testing. Due to the higher dependence on labor costs and more suitable for China's national conditions, semiconductor packaging has become an important component of China's semiconductor industry chain. Up till now, China has more than 200 packaging and testing companies, although many are producing small quantities of small products. enterprise.
With the "Great Leap Forward" in China's IC industry at the beginning of this century, Amkor and StatsChipPac from Singapore came to China with international backgrounds, including Intel, STMicroelectronics, Infineon, Renesas, Toshiba, and Samsung. Major semiconductor companies also successively set up package and test bases in Shanghai, Wuxi, Suzhou, Shenzhen, and Chengdu. Currently, 14 of the top 20 semiconductor manufacturers in the world have established package testing companies in China. Their arrival has improved China. The overall technical level of the packaging and testing industry. At the same time, the local packaging and testing company represented by Jiangyin Changdian has acquired acquisition and independent research and development, and its technology level has been continuously improved. It has become an OEM partner for Texas Instruments and other large international companies.
On September 19, the five-year leader of Hynix Co., Ltd., who had cooperated with Wuxi New District for 7 years, visited the city for the third time during the year and signed a memorandum of understanding with Wuxi New District to sign all-round strategic cooperation. Hynix Semiconductor has been capitalizing for three times since it signed into the new zone in 2004, and it has become the most technologically advanced and largest-capacity semiconductor manufacturing company in the country. The total investment of the company has increased from the initial 2 billion U.S. dollars to 6.055 billion U.S. dollars; From the initial monthly output of 18,000 tablets to the current 180,000 tablets, the production technology is expected to increase to 30 nanometers after the fourth phase of the project, and will also be fully promoted to the 20-nanometer level in the future.
With the upgrading of technology and production capacity of Hynix's manufacturing facilities in China, Haitai Semiconductor, a packaging and testing plant co-invested and built by the Wuxi municipal government and Hynix Semiconductor, naturally became a beneficiary. It is believed that the return on investment brought by the industrial chain to the Wuxi New District and the government is also abundant.
The Yangtze River Delta region centered on Shanghai is a major center of China's integrated circuit industry. From design to manufacturing to packaging and testing, a complete industrial chain has become the capital for the integration and continuous development of integrated circuit companies in the Yangtze River Delta region.
With the introduction of policies for the development of western China, the advantages of preferential policies and manpower cost have allowed Intel, Texas Instruments, and Unisem to build or relocate or acquire new international companies. The China's packaging and testing base has been installed in Chengdu. And other western cities.
Waiting in Bohai Bay As the most concentrated city in Chinese universities, Beijing has obvious advantages in talents, and the IC design industry ranks among the best in the country. SMIC's 300mm plant in Beijing has the most advanced manufacturing technology in China, and the second phase of the 3 plants that are highly regarded by the government is also in full swing. With SMIC Tianjin's 200mm plant and Intel Dalian's Fab68, the integrated circuit industry chain in the Bohai Rim area is only ready to be outsourced by the packaging and testing industry, and a complete industrial chain can be formed.
According to relevant information from the Beijing Municipal Government, in recent years, in order to bring in later-stage sealed-testing companies, the relevant government departments have already approached many well-known domestic and foreign sealed-test companies to discuss investment and construction, but they have not been satisfied due to factors such as cost. result.
As the sealing and testing plants of IDM, including Beijing Renesas Technology, Weixin United Semiconductor, Shougang NEC, and Tianjin Freescale, etc. have now driven the service layout of the supporting packaging and testing equipment and materials company in Beijing, the outsourcing of packaging and testing in the Bohai Rim region The establishment of the factory has become a matter of course.
The global trend of the packaging and testing industry In 2010, the output value of the global packaging and testing industry was approximately 46.2 billion U.S. dollars, of which IDM accounted for 24.10 billion U.S. dollars, and the Outsourcing and Packaging Manufacturers (SATS) accounted for 22.14 billion U.S. dollars. Looking at the proportion of global semiconductor packaging industry in the global semiconductor output value, it rose from 17.5% in 2004 to 18.1% in 2009. It is estimated that by 2013, the proportion will reach 19.5%. The status of the packaging and testing industry in the semiconductor industry is increasingly important. In 2010, the overall output value of the global packaging and testing industry increased by approximately 22.8% from 2009, and SATS increased by approximately 30.5%. The average increase of advanced packaging manufacturers is higher, about 36.5%. This is also the highest increase since 2000.
At any time in the urgency of the physical limits of semiconductor manufacturing processes, the role of packaging in the IC industry chain is increasingly important. Thin, small, exquisite and lovely Apple products give consumers endless enjoyment, and modern advanced packaging technology contributes to its contribution.
With the miniaturization of the semiconductor process to 28 nm, the packaging and measurement technology has also evolved along with the advanced technology. Taiwan-based manufacturers such as Riyueguang, Shanpin, and Shanbang have all actively researched and developed 3D ICs and corresponding system-level packages (SiPs). ) Capacity, including TSV, Copper Pillar Bump and other technologies. The market estimates that the market share of semiconductor product shipments using TSV3DIC technology will increase from 0.9% in 2009 to 14% in 2015.
Yu Junkang, general manager of Jiangsu Changjiang Electronics Technology Co., Ltd., said that compared with the international advanced level, China's semiconductor packaging and testing industry still has a gap of nearly 10 years. The Ministry of Science and Technology 01,02 specifically dedicated to integrated circuit design and the former manufacturing process to give vigorous support, but the packaging and testing seems to have become a subject of being left out. The development of the packaging and testing industry is in line with China's national conditions. At the same time, Chinese companies need to be in line with international standards in the technology sector and move toward the high end, before they can embark on a healthy and sustainable development path.
International semiconductor research firm Gartner released its semiconductor industry analysis report in mid-September, pointing out that global semiconductor sales have been slowing down. It is still unknown whether the economic crisis in Europe and the United States will affect the IC industry. However, generally, during the recession of the industry, companies increase R&D, think deeply, and re-deploy good opportunities. The crisis is a risk breeding opportunity.
The integrated circuit industry is the most complex and most sophisticated industry in the world. It is the focus of national strategic development. China is the largest integrated circuit consumer market in the world. With good market, manpower, and geographical advantages, China's packaging and testing industry will usher in even greater opportunities for development.
