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First, ESA. ElectroStaticAttraction electrostatic adsorption, which can cause serious pollution.
We know that the IC production process requires a clean workshop or a clean workshop. However, few domestic manufacturers can achieve a particle in the clean room. Now the dust particle size is reduced from 0.3μm to 0.1μm, but if the particle size of the adsorbed dust particles is larger than the line width. It is easy to make the product scrapped.
Sometimes customers will ask, the electrostatic protection of the whole process of our wafer production is very good, the grounding is connected, the anti-static equipment to be used is also used, and the purification level is also very high, why put it for a while After that, it will also suck the ash? That is because the machine or the workshop that produces the processed wafers is equipped with FFU high-efficiency filter. When the airflow rubs against the product, it will generate static electricity. When the static electricity accumulates to a certain amount, it will absorb the dust. . Therefore, we recommend installing a static eliminator without a gas source at the lower end of the high efficiency filter to ensure the dynamic balance of the entire space.
Second, ESD. ElectroStaticDischarge electrostatic discharge, which can cause device breakdown.
Electrostatic discharge is a process of charge accumulation. When a charge accumulates to a certain extent, an electric discharge is generated when a conductor approaches it. For a very simple example, in the dry winter, people can easily accumulate static electricity after walking and rubbing. When we touch the metal handle or open the car door, there will be an electric shock. This is electrostatic discharge. Generally, the human body has 3000. When the static electricity is -5000V, there is a feeling of obvious discharge.
The same is true for semiconductor components. If a semiconductor device with a certain amount of static electricity is placed alone or loaded into a circuit module, it will be broken down immediately. After the device is affected by electrostatic discharge, there may be no immediate functional damage, but it will affect the reliability of the component.
The damage caused by electrostatic discharge can reach several billion dollars per year. As a result, many large component and equipment manufacturers have introduced expertise to reduce static buildup in production environments.
Third, EMI. ElectroMagneticInterference electronic interference, which can cause damage.
Electrostatic discharge radiates a lot of radio waves, and these waves are frequency-dependent, causing great interference to surrounding microprocessors, such as confusing program instructions, confusing data, unknown error messages, etc. And these problems are generally not taken seriously, but in the event of failure, the harm it will bring is enormous.
The damage caused by the above hazards is amazing. According to relevant reports, the direct economic loss caused by static electricity in China's electronics industry is as high as several billion yuan per year; the direct economic loss of the electronics industry caused by static electricity in the United States is more than 10 billion US dollars per year; the United Kingdom has also lost nearly 2 billion pounds; In the 1990s in Japan, 45% of unqualified microelectronic devices were caused by static electricity. These figures are very shocking. Adding these global losses together should be able to build dozens of chip makers like Hua Hong NEC, which will bring us much benefit.
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